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The lifetime of a semiconductor device can exceed many years under normal use. But we can't wait years to study the device; we have to increase the applied stress. The applied stress can enhance or accelerate the underlying failure mechanism, helping to identify the root cause.
In semiconductor devices, some of the common acceleration factors are temperature, humidity, voltage, and current. In most cases, accelerated testing does not change the physical characteristics of the fault, but does change the observation time. The change between the accelerated condition and the normal use condition is called "derating".
Highly accelerated testing is a key part of JEDEC-based qualification testing. If the product passes these tests, it means that the device can be used for most use cases.
The laboratory's testing capabilities are listed below:
| Test Item | Test Standard | Apply Stress/Accelerator | Test Purpose |
| Pretreatment (PRE) | JESD22-A113 | Temperature and humidity | Simulate the effects of changing environments, including elevated temperature and humidity, during transportation, storage, and board assembly. |
| Humidity Sensitivity Level (MSL) | IPC/JEDEC J-STD-020 | Temperature and humidity | Determine the classification level of non-hermetic surface mount devices (SMDs) that are sensitive to moisture-induced stress so that they can be properly packaged, stored, and handled to avoid damage during assembly reflow solder connections and/or repair operations |
| High and Low Temperature Impact Test (TCT) | JESD22-A104 | Temperature and humidity change rate | Evaluate a product's ability to withstand alternating high and low temperature extremes |
| No high accelerated stress test (UHAST) | JESD22-A118 | Temperature, humidity, pressure | Evaluation of moisture resistance of non-hermetic encapsulated devices without bias voltage |
| Highly Accelerated Stress Test (HAST) | JESD22-A110 | Temperature, humidity, voltage, pressure | Evaluation of moisture resistance of non-hermetic encapsulated devices under bias voltage |
| High Pressure Cooking Test (PCT) | JESD22-A102 | Temperature, humidity, pressure | Evaluating the moisture resistance of packaging |
| Accelerated Temperature and Humidity Test (THT) | JESD22-A101 | Temperature and humidity | Evaluating the moisture resistance of packaging |
| High Temperature Storage Test (HTST) | GB/T 2423.2 | Temperature | Evaluate the ability of products to withstand long-term humidity and temperature stress |
| Low Temperature Storage Test (LTST) | GB/T 2423.1 | Temperature | Evaluate the ability of products to withstand high-temperature stress for long periods of time |
| Solderability (SD) | EIA/IPC/JEDEC J-STD-002 | Temperature | Evaluate the ability of products to withstand low-temperature stress for long periods of time |
| Salt spray test (SST) | GB/T.2423.17 | acid corrosion | Evaluate the solderability of the product |
| High temperature reverse bias test (HTRB) | JESD22-A108 | Temperature and voltage | Assess the salt spray corrosion resistance quality of products or metal materials |
| High temperature grid bias test (HTGB) | JESD22-A108 | Temperature and voltage | The effect of bias conditions and temperature on the solid-state device over time is determined. |
| High temperature and humidity reverse bias test (H3TRB) | JESD22-A101 | Temperature, humidity, voltage | The effect of bias conditions and temperature on the solid-state device over time is determined. |
| High Temperature Operating Intermittent Life (IOL) | MIL-STD-750 Method 1037 |
Temperature and voltage | Analog device resistance to moisture under high temperature, high humidity, and bias conditions |
| Vibration Test-VVF | JEDEC JESD2-B-103 | Acceleration | Assess whether the product can withstand the vibration environment during transportation or use during the life cycle. |
| ESD(HBM/MM/CDM) | AEC-Q101-001 AEC-Q101-002 AEC-Q101-005 |
Voltage | Evaluate the anti-static ability of the product: simulate the behavior of the human body releasing the accumulated static charge to the ground through the device; simulate the charging and discharging events in the production equipment and process |
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