Quality Assurance

Quality Assurance

Failure analysis

Device failure is the complete or partial loss of functionality, parameter drift, or intermittent occurrence of the above. Failure mode is the external macro manifestation of product failure, including open circuit, short circuit, time-to-time break, abnormal function, parameter drift, etc. According to the failure mechanism. Failure can be divided into structural failure, thermal failure, electrical failure, corrosion failure, etc. Failure analysis method:

(1) Non-destructive analysis: X-ray fluoroscopy, ultrasonic scanning inspection, electrical performance test, morphology test, local composition analysis

(2) Destructive analysis: Kaifeng inspection, profile analysis, probe test, thermal performance test, overall composition test, etc.

TAGORE

National sales hotline 7*24 hours

+86-0592-3193003

TAGORE

Mobile phone number: General Manager Office+86-19525928585/Business Manager +86-15359315036

xmtagore@163.com

9-17 Tianyang Road, jimei district, Xiamen (Mote Industrial Park)

TAGORE
TAGORE

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